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Micromachining & Fine Milling
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Micromachining and fine milling require a spindle with high speed, low vibration and high stiffness
under high load in order to assure the highest quality surface finishing.
The ideal spindle would allow using small tools with exceptional precision.
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Fine Drilling
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Quick and accurate drilling of tiny holes requires spindles with low run out, high-speed rotation - and
compact design. The ideal spindle would be light-weight and compact, with the ability to change tools automatically.
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Soft and Hard-Material Dicing
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For Dicing Silicon wafers, GaAs, PZT, Fiber Glass Epoxy, Alumina, Plastic and Ceremic BGA, or Sapphire, Titanium Carbide,
Glass and Tantalum, a spindle must have high stiffness, low run out and high-speed rotation to provide an exact cutting
matrix. It should have the ability to reverse directions for left and right rotation, to work in a wet environment, and
integrate a dynamic coals contactor for height measurements.
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Wafer testing
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Automatic wafer testing, where a laser scans a rotating wafer for flaws, contamination or defects,
requires a spindle with quick acceleration and deceleration, high speed, and low vibration.
It must be suitable for a clean room environment with the ability to integrate an encoder,
vacuum through the shaft, and self-cooling.
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Spinners
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Optical or Drum Spinners that use a laser to etch plates for printing require a spindle with quick acceleration
and deceleration, high speed, low vibration, and an integrated encoder.
Such a spindle would be based on an aerodynamic concept - pulling atmospheric air -
with no additional air pressure required.
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Optical Components
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For dicing, cutting or polishing optical components, a spindle requires high-speed rotation, low run out,
and high stiffness under high load in order to assure the highest quality surface finishing.
The process should suit grinding of internal and external dimensions with a single clamp.
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